Rubik Soldering Paste 60g, Sn63 Pb37, 3# Microns IPX3 Suitable for PCB, Mobile Phone Repair, Chip Planting and BGA Welding (XGSP80)

Rubik Soldering Paste 60g, Sn63 Pb37, 3# Microns IPX3 Suitable for PCB, Mobile Phone Repair, Chip Planting and BGA Welding (XGSP80)

Name: Rubik Soldering Paste 60g, Sn63 Pb37, 3# Microns IPX3 Suitable for PCB, Mobile Phone Repair, Chip Planting and BGA Welding (XGSP80)
Brand: Rubik
Price: 3415.25 KES
Availability: InStock

Product ID: 564746190

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💎3# micron finesse

🔧60g of precision

⚙️Sn63 Pb37 alloy

Frequently Bought Together

Description

🔍 Elevate Your Repair Game with Precision!

HIGH QUALITY JOINTS - Ensures durable and reliable solder connections every time.
CONTROLLED VISCOSITY - Perfectly balanced for smooth application and minimal mess.
PRECISION ENGINEERING - Crafted with a Sn63 Pb37 alloy for optimal performance.
USER FRIENDLY FORMULA - Designed for effortless application, making repairs a breeze.
VERSATILE APPLICATIONS - Ideal for PCB, mobile phone repairs, and BGA welding.

Rubik Soldering Paste is a high-performance soldering solution featuring a Sn63 Pb37 alloy and 3# micron size, designed for easy application and superior solder joint quality. Perfect for PCB, mobile phone repairs, and BGA welding, this 60g paste is a must-have for professionals seeking reliability and efficiency in their work.

Reviews

O**H

Good product

Makes soldering different alloys much easier

5.01.2024

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Rubik Soldering Paste 60g, Sn63 Pb37, 3# Microns IPX3 Suitable for PCB, Mobile Phone Repair, Chip Planting and BGA Welding (XGSP80)

Description

Reviews

Common Questions